Modularized fabrication of high performance printed circuit boards
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United States of America Patent
Stats
-
Aug 8, 1989
Grant Date -
N/A
app pub date -
Mar 16, 1988
filing date -
Mar 16, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention features a method of fabricating a printed circuit board using a modular technique. Sub-assemblies are first constructed, tested, and then subsequently incorporated into the final circuit board assembly which has a triplate geometry. Lamination of the modular sub-assemblies minimizes dielectric core thickness.
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Cited Art Landscape
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