US Patent No: 4,855,252

Number of patents in Portfolio can not be more than 2000

Process for making self-aligned contacts

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Abstract

A process for making metal contacts and interconnection lines which are self-aligned to each other is disclosed. After semiconductor devices are formed and an insulating/planarizing layer is deposited, a layer of polyimide is deposited. A pattern of trenches into which the metal interconnection lines will be deposited is formed in the polyimide layer. Next, a pattern of contacts to the underlying semiconductor devices is formed in a photoresist layer. This pattern of contacts is subsequently etched into the insulating/planarizing layer. Since both the patterned photoresist layer and the patterned polyimide layer are used as etch masks, the contact windows through the insulating/planarizing layer and the trenches in the polyimide layer will be aligned with respect to each other. After metal deposition, the metal contacts and interconnection lines will be self-aligned.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY68475

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Peterman, Steven Manassas, VA 1 22
Stanasolovich, David Montgomery, NY 20 792

Cited Art

Patent Info (Count) # Cites Year
 
BELL TELEPHONE LABORATORIES, INCORPORATED (1)
4,392,298 Integrated circuit device connection process 14 1981
 
COMMISSARIAT A L'ENERGIE ATOMIQUE (1)
4,544,445 Process for positioning an interconnection line on an electric contact hole of an integrated circuit 15 1984
 
FREESCALE SEMICONDUCTOR, INC. (1)
4,614,021 Pillar via process 54 1985
 
FUJITSU LIMITED (1)
4,646,426 Method of producing MOS FET type semiconductor device 86 1985
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
4,661,204 Method for forming vertical interconnects in polyimide insulating layers 21 1985
 
HITACHI, LTD. (1)
4,315,984 Method of producing a semiconductor device 31 1980
 
MOTOROLA, INC. (1)
4,523,976 Method for forming semiconductor devices 26 1984
 
RCA CORPORATION (1)
4,512,073 Method of forming self-aligned contact openings 33 1984
 
SAMSUNG ELECTRONICS CO., LTD. (1)
4,797,375 Fabrication of metal interconnect for semiconductor device 8 1987
 
TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (1)
4,520,041 Method for forming metallization structure having flat surface on semiconductor substrate 49 1983
 
ZORAN CORPORATION (1)
4,700,465 Method of selectively making contact structures both with barrier metal and without barrier metal in a single process flow 24 1986

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
HITACHI, LTD. (8)
5,868,854 Method and apparatus for processing samples 52 1992
6,077,788 Method and apparatus for processing samples 2 1995
5,952,245 Method for processing samples 1 1996
6,656,846 Apparatus for processing samples 1 2001
6,989,228 Method and apparatus for processing samples 1 2001
6,537,415 Apparatus for processing samples 6 2001
6,537,417 Apparatus for processing samples 2 2001
7,132,293 Method and apparatus for processing samples 0 2004
 
MICRON TECHNOLOGY, INC. (8)
6,492,694 Highly conductive composite polysilicon gate for CMOS integrated circuits 60 1998
6,815,303 Bipolar transistors with low-resistance emitter contacts 1 1998
6,541,859 Methods and structures for silver interconnections in integrated circuits 14 2000
6,573,169 Highly conductive composite polysilicon gate for CMOS integrated circuits 23 2001
6,879,017 Methods and structures for metal interconnections in integrated circuits 7 2003
7,268,413 Bipolar transistors with low-resistance emitter contacts 1 2004
6,893,933 Bipolar transistors with low-resistance emitter contacts 2 2004
7,186,664 Methods and structures for metal interconnections in integrated circuits 3 2005
 
ENERGY, UNITED STATES DEPARTMENT OF (1)
5,256,565 Electrochemical planarization 108 1989
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
6,121,129 Method of contact structure formation 12 1997
 
RENESAS ELECTRONICS CORPORATION (1)
7,489,040 Interconnection structure of semiconductor device 0 2006
 
TEXAS INSTRUMENTS INCORPORATED (1)
4,997,789 Aluminum contact etch mask and etchstop for tungsten etchback 27 1988
 
UNITED MICROELECTRONICS CORP. (1)
6,177,342 Method of forming dual damascene interconnects using glue material as plug material 4 1998
 
UNITED SEMICONDUCTOR CORP. (1)
6,143,655 Methods and structures for silver interconnections in integrated circuits 23 1998