Apparatus and method for the fluid treatment of a workpiece
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 15, 1989
Grant Date -
N/A
app pub date -
Oct 3, 1988
filing date -
Oct 3, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus and method achieves the submersiontype processing of silicon wafers in a manufacturing process for the fabrication of semiconductor devices therefrom. The silicon wafer is uniformly flooded with the process fluid in a manner which prevents impingement thereof during chemical processing, such as wet etching, cleaning, photoresist developing and the like. Upon flooding the silicon wafer, a gas pocket is formed between a portion of the lower surface of the wafer and an adjacent portion of vacuum chuck to which the wafer is mounted. The resulting gas pocket prevents accumulation of processed fluid therein to facilitate spin drying of the wafer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully