Vessel and system for treating wafers with fluids
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United States of America Patent
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-
Aug 15, 1989
Issued Date -
N/A
app pub date -
Nov 25, 1987
filing date -
May 21, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is apparatus for treating semiconductor wafers with fluids. The device comprises one or more vessels having lateral walls defining open ends. The vessels are arranged serially, and the open ends are engaged with a treatment fluid inlet and a treatment fluid outlet. Wafers or a wafer carrier are introduced into the vessels for treatment. The vessels are constructed of material that is inert to the treatment fluids and designed to minimize creation of eddy currents and fluid traps. Hydraulically full fluid flow through the vessel uniformly contacts the wafers with the fluid and results in improved and more reproducible prediffusion cleaning, rinsing, etc.
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