Apparatus and a method for carrying wafers
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United States of America Patent
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-
Aug 15, 1989
Grant Date -
N/A
app pub date -
Nov 16, 1987
filing date -
Nov 25, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wafer carrying apparatus comprises a heat treatment plate for heat treating a wafer, the treatment plate having a plurality of through-holes spaced apart from each other at a prescribed distance. A plurality of pins are disposed to protrude from and to be retractable below the main surface of the heat treatment plate, through the through-holes. The tips of pins are kept at the same height and a pair of spaced elongated members, for example wires, whose relative spacing and position are changeable are effective for carrying and placing the wafer onto and removing the wafer from atop the pins.
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