Method and apparatus for bonding with consistent uniform bond thickness
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United States of America Patent
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Aug 15, 1989
Grant Date -
N/A
app pub date -
May 20, 1988
filing date -
May 20, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus are disclosed for bonding a semiconductor die to a semiconductor circuit package base with silver glass paste. Consistent and uniform bond thickness is achieved by first positioning the die so that it is in contact with the package base and recording this position, then offsetting the position of the die a measured distance from the recorded position using a micrometer.
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