Nickel particle plating system
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United States of America Patent
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-
Aug 15, 1989
Grant Date -
N/A
app pub date -
May 26, 1988
filing date -
May 26, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A nickel particle plating system in which a multiplicity of minute nickel spheres are provided with a heavy copper coating and then a comparatively thin silver coating. The copper coating is at least about 20 percent by weight of the shpere, and the silver coating has a maximum thickness of about 15 percent of the sphere diameter. The coated spheres are deposited in a nonconductive matrix to form an electroconductive body in which the spheres may be placed along conductive paths.
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