Method of forming bump electrode and electronic circuit device
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United States of America Patent
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-
Aug 15, 1989
Grant Date -
N/A
app pub date -
Jun 29, 1988
filing date -
Jun 30, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A support is formed and comprises a base, a resin layer which is formed on the base and on recesses which are formed on a surface of the base, and a conductive layer which is formed on a portion of a surface of the resin layer, other than where the recesses are formed. The surface of the recesses is electrically charged by way of a corona discharge to create static electricity in the recesses. Metal balls to be formed into bump electrodes are held in the recesses by way of the static electricity. Then, each of the metal balls is bonded to a corresponding electrode terminal of an electronic component by hot press unit while the electronic component is opposed to the support.
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