Solder coating apparatus
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United States of America Patent
Stats
-
Aug 22, 1989
Grant Date -
N/A
app pub date -
Aug 31, 1988
filing date -
Sep 2, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A soldering machine for simultaneously applying liquid solder to opposite sides of the leads of a lead frame having I.C. devices thereon. The machine has sidewardly spaced rolls which define a vertically extending narrow nip therebetween through which the lead frame passes. A solder bath is disposed below the rolls so that the lower portions of the rolls dip into the bath and carry a solder film to the nip for application to opposite sides of the leads. A passage extends upwardly in isolation from the bath for permitting the lead frame to be fed vertically through the nip.
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Cited Art Landscape
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