Orthogonal bonding method and equipment
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United States of America Patent
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-
Aug 22, 1989
Grant Date -
N/A
app pub date -
Mar 29, 1988
filing date -
Mar 29, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Wire bonds are closely spaced about the edge of a semiconductor chip device (150) in an orthogonal array. Even though the wires may have a fan out pattern to their second bond locations, close spacing of the first bond pads is achieved by use of rectangular pads (154) having their long dimensions all perpendicular to the chip edge, making all of the first bonds along lines perpendicular to the chip edge and then bending the wire to extend to the second bond.
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