Semiconductor chip carrier package
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United States of America Patent
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-
Aug 22, 1989
Grant Date -
N/A
app pub date -
Apr 27, 1988
filing date -
Apr 27, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip carrier package formed of a multi-layer circuit board having mounted therein a semiconductor chip support pad. The multi-layer circuit board is comprised of separate dielectric boards defining multiple conductive run layers including a signal layer and a plurality of power layers. A pluralilty of pins supported from the circuit board extending from one side thereof and including signal pins and power pins. The power pins are disposed peripherally outside of the signal pins. Means are provided for conductively connecting leads of the semiconductor chip to corresponding conductive runs of the signal and power layers.
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