Fixture for plating tall contact bumps on integrated circuit
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United States of America Patent
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-
Aug 29, 1989
Grant Date -
N/A
app pub date -
Apr 13, 1987
filing date -
Apr 13, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A transportable bump plating fixture and method for holding a semiconductor wafer in a face up orientation in a plating bath while plating bumps on the metallized circuitry on the wafer face. The fixture includes an elastomer pad which contacts the back of the wafer and forms a seal which prevents the plating bath from coming into contact with the back of the wafer. The fixture also includes means for forming a cathodic electrical connection to the metallization on the face of the wafer, and further includes a plating anode disposed above the face of the wafer. The fixture is open to the flow of the plating bath over the face of the wafer and between the face of the wafer and the anode.
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