Molded circuit board and manufacturing method therefor
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United States of America Patent
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-
Aug 29, 1989
Issued Date -
N/A
app pub date -
Feb 3, 1988
filing date -
Sep 3, 1982
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A molded circuit board is formed with a nonconductive molded polymer substrate base having at least one channel in a surface thereof. A sputtered conductive film is disposed in the channel on a virgin polymer surface thereof to establish a circuit line in the channel.
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Cited Art Landscape
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