Laser scribing system and method

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United States of America Patent

PATENT NO 4861964
SERIAL NO

07097190

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A laser scribing system and method is described. In the system, a film formed on a substrate is irradiated with laser beam which is focused on a limited portion of the film in order to remove the portion and produce a groove. Laser beam used for eliminating the portion of film formed on a substrate is deprived of its border portion in advance of the focusing. Spherical aberration is suppressed due to this elimination.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR ENERGY LABARATORY CO LTD 398 HASE ATSUGI-SHI KANAGAWA 243 JAPAN A CORP OF JAPANNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sinohara, Hisato Sagamihara, JP 2 116

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