Package semiconductor chip
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 29, 1989
Issued Date -
N/A
app pub date -
Feb 19, 1988
filing date -
Apr 18, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is directed to a packaged semiconductor chip which effectively dissipates heat and has improved performance. The packaged chip has a plurality of lead frame conductors extending through the encapsulating material which are adhesively joined to the semiconductor chip, preferably by means of an alpha barrier. The conductors cover a substantial portion of the surface of the chip and thereby serve as conduits for the dissipation of heat from the chip. Wires are bonded to the conductors and extend from the conductors to the terminals on the semiconductor chip. In a preferred embodiment the semiconductor chip terminals are located along a center line of the chip. This allows for short connecting wires which in turn contribute to faster chip response.
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