Importance

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Abstract

Wafer prober usable for examining, in a predetermined sequence, integrated microcircuits formed on a semiconductor wafer, is disclosed. The prober includes a contact plate which is movable in a Z-axis direction (the direction of height). The contact of the contact plate to a probe needle group is detected by detecting deformation of the contact plate. From the position of the contact plate at the time of deformation, the position of the needle tips of the probe needle group in the Z-axis direction is detected automatically. In another aspect, a laser beam source and a photosensor are provided as a unit with a wafer stage which is movable in each of an X-axis direction, a Y-axis direction and a .theta. (rotational) direction while carrying thereon a semiconductor wafer. With the aid of the movement of the wafer stage, the laser beam emitted from the laser beam source toward the photosensor is crossed by the probe needle group. On the basis of an output of the photosensor and the position of the wafer stage, at the time of the crossing, the position of the probe needle group with respect to each of the X-axis direction, the Y-axis direction and the .theta. direction is detected automatically. In a further aspect, automatization of the positioning of a probe card occurs when it is introduced into a wafer prober.

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First Claim