Low dielectric printed circuit boards
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United States of America Patent
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-
Sep 12, 1989
Grant Date -
N/A
app pub date -
Mar 16, 1988
filing date -
Mar 16, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention features a method of fabricating a printed circuit board with low dielectric materials using a modular technique. Sub-assemblies are first constructed, tested, and then subsequently incorporated into the final circuit board assembly which has a triplate geometry. Dielectric materials are chosen which enhance the performance of the circuit board.
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Cited Art Landscape
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