Electroless deposition employing laser-patterned masking layer
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United States of America Patent
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Sep 12, 1989
Issued Date -
N/A
app pub date -
Dec 7, 1987
filing date -
Sep 15, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A metal is electrolessly plated on a substrate which is first coated with at least one ablatively-removable layer that is selectively irradiated with laser radiation to obtain a pattern for the deposition of metal on the substrate. The electroless plating solution applied to the substrate after the irradiated substrate is coated with a catalyst also serves to remove the unirradiated portion of the ablatively-removable layer. The method is particularly suited for plating fine lines of metal, especially on non-planar surfaces.
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