Thermally stable dual metal coated laminate products made from textured polyimide film
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United States of America Patent
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Sep 19, 1989
Issued Date -
N/A
app pub date -
Feb 16, 1988
filing date -
Feb 24, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion, as well as a modification of IPC test 2.4.9 method E for resistance to thermal cycling.
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