High performance circuit boards
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United States of America Patent
Stats
-
Sep 19, 1989
Grant Date -
N/A
app pub date -
Mar 7, 1988
filing date -
Mar 7, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention features a method of fabricating a printed circuit board having improved circuit board performance. The circuit board utilizes low dielectric materials having dielectric constants of less than 3.0. The dielectric layers are spaced apart from plated through-holes, thus eliminating the interface between the metallized surface of the through-hole and the dielectric sheet. Thus, the low dielectric layer is not required to be plated. The lower dielectric character of the laminates improves wiring density, circuit speed, and provides for thinner laminates and cores.
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