Apparatus for treating the surfaces of wafers
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United States of America Patent
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-
Oct 3, 1989
Grant Date -
N/A
app pub date -
Jun 27, 1988
filing date -
Jun 26, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for treating the surface of wafers with a vaporous agent. The apparatus includes an arrangement in which, prior to being discharged, excess vapor stays for a while outside a treating chamber so as to keep the treating vapor and the discharging excess vapor at the same vaporous level. Thus, treating vapor evenly contacts the entire surface of a wafer.
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