Method and apparatus for aligning solder balls
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United States of America Patent
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-
Oct 3, 1989
Grant Date -
N/A
app pub date -
Jul 26, 1988
filing date -
Sep 14, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Solder balls are supplied onto an aligning plate having aligned through-holes formed therein. Air is sucked from the bottom of the above described aligning plate to fit and attract solder balls into the above described through-holes. Solder balls are thus aligned with high work efficiency.
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