Bonding thermoplastic layers via electrical heating
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United States of America Patent
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-
Oct 3, 1989
Grant Date -
N/A
app pub date -
Feb 24, 1988
filing date -
Mar 2, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of bonding a thermoplastic layer (22), such as APC-2, to a substrate (21) in which the thermoplastic layer (22) comprises electrical conductors such as carbon fibres, embedded in thermoplastic material such as PEEK. The method comprises placing the thermoplastic layer (22) in contact with the substrate (21); and inducing electric currents in the conductors whereby heat generated by the currents passing through the conductors causes thermoplastic material to bond the layer to the substrate.
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