Hot melt adhesive composition
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United States of America Patent
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-
Oct 3, 1989
Issued Date -
N/A
app pub date -
Aug 23, 1988
filing date -
Oct 3, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A hot melt adhesive composition comprising (A) 99 to 80 wt % of a thermoplastic resin selected from the group consisting of a substantially amorphous thermoplastic saturated polyester resin, an ethylene-vinyl acetate copolymer and an ethylene-ethyl acrylate copolymer and (B) from 1 to 20 wt % of a monofunctional or polyfunctional cyanate ester compound having at least one cyanato group in the molecule is disclosed. The hot melt adhesive composition can further contain a co-modifier, a monofunctional or polyfunctional maleimide compound or a cross-linking catalyst for the thermoplastic resin (A). This composition has improved adhesive force, mechanical characteristics and heat resistance.
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