Interconnection systems for electrical circuits
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United States of America Patent
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-
Oct 10, 1989
Grant Date -
N/A
app pub date -
Nov 23, 1987
filing date -
Mar 25, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Electrical circuits can be built up in three dimensions by using spacers (20, 20') which interlock together to define stacks. Stacks can be used to clamp together chip carriers between adjacent spacers or to provide power and signal transmission stacks (120) which have a number of continuous tracks (110). Link members (126, 128) are used to provide electrical connection means between the chip carriers in the chip carrier stacks and the tracks of the power and signal transmission. stacks.
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