Epoxy resin composition

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United States of America Patent

PATENT NO 4877822
SERIAL NO

07179538

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Abstract

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An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.

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Patent Owner(s)

Patent OwnerAddress
SHIN-ETSU CHEMICAL CO LTD NO 6-1 OHTEMACHI 2-CHOME CHIYODA-KU TOKYO JAPANNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Futatsumori, Koji Annaka, JP 27 528
Itoh, Kunio Annaka, JP 95 1779
Shimizu, Hisashi Annaka, JP 65 856
Shiobara, Toshio Annaka, JP 233 2183
Tomiyoshi, Kazutoshi Annaka, JP 48 542

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