Semiconductor integrated circuit device
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United States of America Patent
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-
Oct 31, 1989
Issued Date -
N/A
app pub date -
Mar 24, 1989
filing date -
Sep 16, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor integrated circuit device according to the present invention comprises a chip substrate formed of a semiconductor. Formed on a surface of the chip substrate is an integrated circuit and a plurality of chip terminals which are located to the outside of the integrated circuit, so as to be connected thereto. An electrical insulating layer covers the entire surface of the chip substrate, and conductor leads equal in number to the chip terminals are formed on the insulating layer. One end of each conductor lead is connected to a corresponding chip terminal, and the other end thereof is formed having a connecting terminal whose surface area is greater than that of each chip terminal. The connecting terminals are distributed substantially over the entire surface of the insulating layer.
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