Apparatus for manual wire bonding

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United States of America Patent

PATENT NO 4878609
SERIAL NO

07150668

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Abstract

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An apparatus for manual wire bonding, comprising an ultrasonically energizable and/or thermocompression wedge (11) for pressing the wire (34) against a bonding pad, wherein the wedge (11) is part of a bonding head (10) adapted to be moved towards and away from said bonding pad, especially in up/down direction. The bonding pad is disposed on a base which is movable in a direction approximately transversely to the direction of movement of the bonding head (10) for positioning the bonding pad opposite said wedge (11). Furthermore, means is provided for controlling the drive unit (20) of the bonding head. Preferably, the drive unit (20) for the bonding head motion is a d.c. servomotor, wherein each part-motion and non-motion of the bonding head (10) can be adjusted individually in respect of travelling distance and speed and motionless period, respectively, and can be checked as to execution. To this end the drive unit (20) cooperates with a distance and speed control (44-51) and feedback (28) unit.

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Patent Owner(s)

Patent OwnerAddress
F & K DELVOTEC BONDTECHNIK GMBHDAIMLERSTRASSE 5 85521N OTTOBRUNN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Farassat, Farhad Munich, DE 24 324

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