Electronic circuit chip connection assembly and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 7, 1989
Issued Date -
N/A
app pub date -
May 30, 1989
filing date -
Apr 6, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This assembly allows connecting in one operation a plurality of chips to chips and to a substrate or each chip to a substrate using an elastomeric pressure means that continues to pressure chips connecting micron sized leads to chip pads on one end and to circuitry on a substrate on the other end; a metallic cover fastening to the substrate and containing said electronic pressure means also includes a ribbed projection to hermetically seal the unit so that the substrate itself becomes an integral part of the assembly package.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully