Lead- and antimony-free solder composition
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United States of America Patent
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Nov 7, 1989
Grant Date -
N/A
app pub date -
Apr 19, 1989
filing date -
Apr 19, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Lead-free and antimony-free solder compositions are described which comprise, as essential ingredients, about 0.05% to about 3% by weight of silver; about 0.5% to about 6% by weight of copper; about 0.1% to about 3% by weight of bismuth; and about 88% to about 99.35% by weight of tin. In preferred embodiments, the solders are also essentially free of cadmium and may also be essentially free of both cadmium and zinc.
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