High density controlled impedance connector
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 21, 1989
Issued Date -
N/A
app pub date -
Sep 11, 1987
filing date -
May 23, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A high speed, high density, controlled impedance connector for use between printed circuit boards is disclosed. The connector provides for both power and signal transmission. Closely spaced signal terminals are surrounded by dielectric sleeves positioned in an array, and the plural dielectric sleeves are in turn surrounded by an outer unitary cast conductive housing. The essentially coaxial configuration of the contacts permits minimal variations in the impedance along the length of the signal paths in the connector. The connector is fabricated by first positioning the dielectric sleeves in spaced relationship on prescribed centerlines and subsequently casting or molding the conductive outer housing around the sleeve array.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully