Method of manufacturing printed circuit boards
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United States of America Patent
Stats
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Nov 21, 1989
Issued Date -
N/A
app pub date -
Apr 1, 1988
filing date -
May 23, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention relates to a method of manufacturing printed circuit boards. The manufacturing method of printed circuit boards under the present invention is to detach a release paper from a metal board on which holes are provided and to which the adhesive sheet and a release paper are attached. Thereafter, the metal board is glued to a resin board having at least one circuit layer and at least either of through holes or lead wire holes, by means of the adhesive sheet by pressing. An alternative manufacturing method of printed circuit boards under the present invention is to provide lead wire holes at the centers of resin filled holes in a metal board material, and to which an adhesive sheet and a release paper are attached. From the metal board material, a metal board is made by finishing its outer configuration. The release paper is detached from the metal board. Thereafter, the metal board is glued by pressing to a resin board having at least one circuit layer and at least either of through holes or lead wire holes, by means of the adhesive sheet.
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