Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
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United States of America Patent
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-
Nov 21, 1989
Issued Date -
N/A
app pub date -
Oct 21, 1987
filing date -
Aug 29, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A novel immersion tin composition is disclosed containing both thiourea compounds and urea compounds. A method for improving the adhesion of printed circuit boards to one another in a multilayer board and for minimizing or eliminating smear in a multilayer board is also disclosed comprising coating the metal layers of the individual circuit boards with an immersion tin coating prior to laminating them to form a multilayer board.
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