Cooling device for a sputter target and source

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United States of America Patent

PATENT NO 4885075
SERIAL NO

07290882

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Abstract

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A device for cooling a sputter target of a deposition apparatus utilizes an annular shaped member of high thermal conductivity disposed between the cathode and the target electrode. The member is constructed of a base disposed in a corresponding recess in the cathode, or integrally formed therewith, and a member projecting perpendicularly from the base disposed in a corresponding annular shaped recess in the target electrode. One or more members are disposed proximate a source of cooling water applied to the cathode, and at points of greatest power flux in the target electrode. Upon heating, the target electrode expands radially against the members, thereby effecting reduction in the temperature of the target electrode.

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Patent Owner(s)

Patent OwnerAddress
MACHINE TECHNOLOGY INCPARSIPPANY NEW JERSEY 07054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hillman, Gary Livingston, NJ 28 302

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