High temperature post exposure baking treatment for positive photoresist compositions
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United States of America Patent
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Dec 5, 1989
Issued Date -
N/A
app pub date -
Oct 17, 1986
filing date -
Mar 11, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention provides a method for producing a photographic element which comprises coating a substrate with a positive working photosensitive composition which composition comprises an aqueous alkali soluble resin, a quinone diazide photosensitizer and a solvent composition, heat treating said coated substrate at a temperature of from about 20.degree. C. to about 100.degree. C. until substantially all of said solvent composition is removed; imagewise exposing said photosensitive composition to actinic radiation; baking said coated substrate at a temperature of from about 120.degree. C. to about 160.degree. C. for from about 15 seconds to about 90 seconds; and removing the exposed non-image areas of said composition with a suitable developer.
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