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Abstract

A CMOS output buffer interconnects binary logic integrated circuits. The output buffer is readily configurable through variation of a single metallization mask during fabrication for providing interconnection of integrated circuits through either transmission lines or lumped loads. The CMOS output buffer provides a pull-up circuit for pulling an output terminal to a voltage level corresponding to a first logical state and a pull-down circuit for pulling the output terminal to the complementary logical state. The pull-up and pull-down circuits each include a plurality of parallel connectable output drivers. A selected number of output drivers can be connected to the output terminal during fabrication of the integrated circuit through the appropriate metallization mask. The pull-up and pull-down circuits each include a distributed, continuous control electrode providing for delayed propagation of actuation signals. Selective metallization between points of a control electrode prescribes different time rates of propagation of an actuation signal.

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