Method for manufacturing plastic encapsulated semiconductor devices
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United States of America Patent
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-
Dec 19, 1989
Grant Date -
N/A
app pub date -
Aug 27, 1987
filing date -
Aug 27, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for correctly positioning a metallic plate supporting a semiconductor chip in a mold used for encapsulation, wherein according to a first solution, at least a pair of retractable locating pins are utilized together with a lead connected to the supporting plate. The ends of the locating pins are retracted in the final phase of encapsulation, from the surfaces of the plate, whereas in the initial phase they are in direct contact with the surfaces. According to a second solution, a pair of clamping pins are indirectly connected to the plate through the interposition of insulating thicknessings.
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