Integrated circuit product having a polyimide film interconnection structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 26, 1989
Issued Date -
N/A
app pub date -
Jul 13, 1987
filing date -
Jan 31, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for making integrated circuits in which a polyimide/conductor multilevel film (17) in cast on a substrate (10), using available or existing semiconductor processing equipment. The polyimide film (17) is formed from readily available polyamic acid resins, and the conductor (16) can be sputtered aluminum formed to interconnection conductor patterns (16,16-) by standard photolithographic techniques. After fabrication of the multilayer film (17), the conductors (16,16') of the film (17) and the device circuit (30) are brought into aligned contact, and the device circuit (30) affixed to the film (17). The film (17) and the device circuit (30) are then removed from the substrate (10) for further processing, such as bonding the device and film to a mother board or leadframe, as desired.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully