Method for producing displays and modular components
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United States of America Patent
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-
Jan 2, 1990
Issued Date -
N/A
app pub date -
Apr 14, 1989
filing date -
Jan 15, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Processing techniques for various modular components provide various surface mount structures for single device components (10) and multiple device components (FIGS. 6 and 7) suitable as character displays. The technique beings with a slab of substrate material 12 patterned on both sides. Plated through holes (33, 43) connecting back side terminals (19, 20) to front side connective strips (22, 24) are formed. Devices (15, 16) are mounted to land areas (13, 34) and wire bonded to connecting pads (14). The front side is coated with epoxy to encapsulate the devices in a layer having an outer surface formed into optional lenses (262, 263). The slab is then separated to provide the modular components.
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