Connecting structure for electronic part and method of manufacturing the same
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United States of America Patent
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Jan 9, 1990
Grant Date -
N/A
app pub date -
Jan 13, 1988
filing date -
Jan 19, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a connecting structure for electrically connecting an electronic part such as an LSI chip to a substrate and a method of manufacturing the same. The present invention is suitable especially for electrical connection between a plurality of chips and a substrate which is required to have a function of absorbing a difference in thermal expansion in the horizontal direction and to deform in the vertical direction, and characterized in that a conductive flat spring having a height not more than the minimum length in the lateral direction is provided between the electronic part such as a chip and a wires substrate.
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