Metal-core printed wiring board and a process for manufacture thereof
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United States of America Patent
Stats
-
Jan 16, 1990
Grant Date -
N/A
app pub date -
May 6, 1988
filing date -
May 6, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Method of printed circuit board manufacture, and resulting board. A plurality of prepreg sheets composed of ceramic paper and containing different quantities of a resin are laid on each side of a core metal sheet having a through hole. A copper foil is laid on the prepreg sheets on each side of the core. All of the layers are pressed together under heat to make a metal-core printed wiring board. The prepreg sheets form an insulating layer having a high heat-dissipating capacity on each side of the core and a reliable insulator in its through hole. The ceramic paper consists essentially of short ceramic fibers having a diameter not exceeding fiber microns and a length of 5 to 500 microns, and contains 3 to 10% by weight of microfibrillated cellulose fibers as a binder for the ceramic fibers.
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