Semiconductor device having a light transparent window and a method of producing same
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United States of America Patent
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-
Jan 16, 1990
Grant Date -
N/A
app pub date -
Feb 12, 1988
filing date -
Feb 12, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device having a light transparent window includes: a wall produced at an outer contour of a light receiving section on the surface of a semiconductor chip, the molding resin which is produced after a process of inserting the chip in a metal mold. The wall and the metal mold adhere with each other for producing a space between the chip and the metal mold so that a light transparent window is produced at a light introduction section in a separate position from the wall above the chip.
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