Data carrier having an integrated circuit and a method for producing the same
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United States of America Patent
Stats
-
Jan 30, 1990
Grant Date -
N/A
app pub date -
Nov 6, 1987
filing date -
Nov 20, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention relates to a data carrier having an integrated circuit and to a method for making the same. During production a carrier element equipped with an integrated circuit and contact surfaces is inserted into a recess in the data carrier blank. To allow for the carrier element to be fixed in the recess, said element is underlaid with a melt adhesive film. To protect the integrated circuit from mechanical stresses, a film strip made of a material with high elastic deformability is provided additionally between the circuit and the melt adhesive film.
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