Importance

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Abstract

A metal heat spreading cup, hereinafter referred to as a 'conductive cup module' ('CCM'), is utilized as part of the interface between at least one semiconductor being cooled and a pedestal, sometimes referred to as a 'boss', coupled to a cooling medium. The semiconductor being cooled is, according to one embodiment of the invention, bonded to the underside of the cup. Furthermore, according to the invention, the pedestal is inserted into the cup and is bonded thereto by use of a deformable thermal conductive compound, (such as a thermal paste or grease) also inserted into and contained within the cup. The compound spreads upon being displaced by the inserted pedestal. The compound remains deformable during operation of the cooling system. After the pedestal is inserted and the compound is displaced, the inside bottom and sides of the cup (without overfilling) are lined with the compound and a thermal contact between the cup and the pedestal is achieved on all surfaces of the pedestal inserted into the compound. The cup and pedestal are separated from each other by the thermal compound and therefore electrical isolation of these components is achieved. The result is a cooling system wherein (1) the CCM acts as both a heat spreader and containment cup; (2) electrical isolation between a given semiconductor and the heat sink is performed; and (3) inherent thermal expansion compensation is achieved by virtue of the deformable (paste like) layer between the cup and pedestal.

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First Claim