Thick film resistor type printed circuit board
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United States of America Patent
Stats
-
Feb 6, 1990
Grant Date -
N/A
app pub date -
Jan 4, 1989
filing date -
Mar 7, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A thick film resistor type printed circuit board including an insulating substrate, a plurality of pairs of terminal electrode layers made of silver and formed on the insulating substrate, a plurality of resistor layers formed on the terminal electrode layers so as to connect the pairs of the terminal electrode layers, respectively, a plurality of wiring conductive layers made of copper and connected to predetermined ones of the terminal electrode layers so as to coat the predetermined ones of the terminal electrode layers and a protective layer for covering at least a portion of the insulating substrate, in which portion the terminal electrode layers and the resistor layers are formed.
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