Method and apparatus for transporting semiconductor wafers
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United States of America Patent
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-
Feb 13, 1990
Grant Date -
N/A
app pub date -
May 25, 1988
filing date -
May 25, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for releasably engaging a semiconductor wafer (12) comprises a frame (18) adapted for engagement by a robotic arm (26). The frame mounts one end of an elongated arm (30) dimensioned for insertion into a pocket (14) in a wafer-carrying cassette (16). The arm has a first jaw (34) depending from its end distant from the frame for engaging a portion of the edge of the wafer. A second jaw (38) extends through a slot (46) in the arm so as to be opposite the first jaw for engaging a portion of the edge of the wafer diametrically opposed to that engaged by the first jaw. The second jaw is displaced to and from the first jaw by a pneumatic cylinder (48) to enable the wafer to be releasably captured between the jaws without any damage to the surfaces of the wafer.
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