Vacuum processing method and apparatus
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United States of America Patent
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-
Feb 20, 1990
Grant Date -
N/A
app pub date -
Oct 27, 1987
filing date -
Oct 30, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A vacuum processing method and apparatus in which a DC bias to be produced on the surfaces of substrates which are to be processed in a vacuum chamber can be mechanically and easily controlled by adjusting the position of a susceptor in respect to an electrode body, and the susceptor and other components in the vacuum chamber can be easily cleaned while maintaining a desired evacuated condition and a desired processing performance in the vacuum chamber.
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