Process for treating copper surface
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United States of America Patent
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Feb 20, 1990
Grant Date -
N/A
app pub date -
Jul 27, 1988
filing date -
Dec 14, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Adhesion of copper to a resin layer is improved by reducing a copper oxide layer with an aqueous aldehyde solution (a) while applying a potential of -1000 mV to -400 mV to the copper oxide layer, (b) after contacting with a metal piece made of copper or a metal nobler than copper, or (c) after contacting with an aqueous solution of alkali borohydride.
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