Compressive pedestal for microminiature connections
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United States of America Patent
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-
Feb 20, 1990
Issued Date -
N/A
app pub date -
Aug 1, 1988
filing date -
Dec 20, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Apparatus is disclosed for providing microelectronic, intra-chip and chip-to-chip interconnections in an ultra-dense integrated circuit configuration. Compressive pedestals 20 are used to form spring-loaded electrical and mechanical interconnections to conductive terminals on a chip interface mesa and chip assembly 28 in order to form a large multi-chip array 23 on an interconnection substrate 24. Methods are also disclosed for fabricating the compressive pedestals 20.
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