One-part curing composition

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United States of America Patent

PATENT NO 4902736
SERIAL NO

07243308

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Abstract

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A one-part curing composition comprising a compound (a) having two or more structural groups, per molecule, expressed by the general formula: ##STR1## wherein R.sup.1, R.sup.2, and R.sup.3 are groups selected from an alkyl group having 1 to 6 carbon atoms, a phenyl group, and a chloromethyl group, and a polymer (b) having two or more isocyanate groups per molecule, has a good stability in storage under conditions which exclude moisture and humidity, and which further cures in the presence of humidity. This composition does not foam under high temperatures and humidities and has a good heat resistance.

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Patent Owner(s)

Patent OwnerAddress
TORAY THIOKOL COMPANY LIMITEDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dokoshi, Noriaki Ichihara, JP 2 20
Matsui, Tatsuro Funabashi, JP 2 20
Nakajima, Masashi Ichihara, JP 17 125
Nonaka, Toshiaki Ichihara, JP 43 237

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